- Possible to make full-scale thermal profiles with 6-zone hot air and a bottom heater.
- Possible to measure and record temperature of components and PWB with type K thermocouple.
- The dedicated software to link a station and a computer for easy and quick settings.
- Easy data transfer through an USB cable
The functions needed for SMD rework are in a compact body
A low cost SMD rework can be assembled with FR-811, dedicated software and options.
・Possible to make full-scale thermal profiles with 6-zone hot air and a bottom heater.
A basic thermal profile is composed of the 5 parts shown above. FR-811 can provide 6 zones in which temperature, time, and air flow are controlled. Therefore FR-811 can make a full-scale thermal profile which is close to reflow profiles made by a reflow oven.
・Record thermal data
By connecting a thermocouple included with FR-811, the temperature of the component or circuit board can be measured and recorded. In addition, if “TC LINK” is set, the heater output can be automatically controlled so that the temperature of the thermocouple attached to the component or circuit board follows the set profile.
・Operation on a PC for various settings
By connecting FR-811 and a computer with a USB cable and using the dedicated software which comes as standard, a set thermal profile and actual temperature change can be shown in a graph in real time. Also, change of thermal profile and fine adjustment in a profile can be made on a computer operation. (After making changes, it is necessary to resend the data to FR-811.)
In addition, the set values and graph can be saved in csv format.
・Linked operation with bottom heater
FR-811 can control on/off timing and output of the bottom heater, which is available optionally.
High power and large volume hot air for quick removal of components
A tool that can provide powerful hot airflow for repairing high heat capacity circuit boards that require high blow volume and high output, and sufficient hot airflow for appropriate blow volume and high output for high-density mounting substrates.
High power and large volume hot air for quick removal of components
A tool that can provide powerful hot airflow for repairing high heat capacity circuit boards that require high blow volume and high output, and sufficient hot airflow for appropriate blow volume and high output for high-density mounting substrates.
New user friendly functions for SMD rework
・New type of nozzles for improving temperature characteristics
The new nozzles improve work efficiency with uniform heating by hot air convection inside the nozzle which is created due to vents on the nozzle top. (Only with BGA nozzles)
・Vacuum pickup function
The vacuum pickup function is to pick up a component with a suction pad and vacuum.
It will pick a component only after the hot air melts solder joints. This can avoid an error to peel off the land by removing a component with excessive force.
・Pickup indicator
By pre-setting pickup function, a component can be picked up automatically when solder is melted. At the same time, the indication comes up and the moment of picking up will be visible. Even a component and solder joints can not be seen as covered by a nozzle, easy and safe picking up is possible.
Interface designed for intuitive operation. Possible to link to a PC
・Easy-to-read LCD
Equipped with a high-visibility LCD to make it easy to check the various product settings or operation status. Indications are displayed using graphics as well as letters and numbers so information can be checked intuitively.
・Easy-to-operate multi-direction control knob
The multi-direction control knob makes it easy to make and change settings shown in the LCD.
There are several ways of knob movements, dialing, pressing, and tilting up and down and left to right for quick operation.
・Link to a PC (A USB I/F terminal available)
A USB I/F terminal is available to link to a computer. The dedicated software, which can display and record various settings or temperature data on a computer screen in real time, is included.
・A USB device terminal for easy data transfer
Data can be transferred through a USB memory even without a computer.
Use conventional HAKKO nozzles
Align the projection part, attach the conventional nozzle to the heater pipe.
*The heater pipe of HAKKO FR-810 (discontinued) has two projection parts. In order to use the conventional nozzle, put the conversion adaptor on the heater pipe that was included in your purchased HAKKO FR-810 as one of standard accessories.
Simple nozzle removal and easy maintenance
Nozzle can be changed quickly when working with a wide range of components. Conventional HAKKO nozzles can be used by using a special conversion adapter (option).
Heater replacement is also simple.
